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Download Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX (Proceedings of Spie) eBook

by Douglas J. Resnick

Download Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX (Proceedings of Spie) eBook
ISBN:
0819403105
Author:
Douglas J. Resnick
Category:
Physics
Language:
English
Publisher:
Society of Photo Optical; 1st edition (December 1, 1990)
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PROCEEDINGS VOLUME 1465. Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing

PROCEEDINGS VOLUME 1465. Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing. The effect of electron beam acceleration voltage and beam sharpness upon process latitudes of . micrometers line fabrication is estimated by computer simulation.

Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX (Proceedings of S P I E). ISBN. 0819403105 (ISBN13: 9780819403100).

Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing).

SPIE 1263, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX, pg 12 (1 May 1990); doi . Purchase complete book on SPIE. Electron-Beam and X-Ray Resist Technology.

SPIE 1263, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX, pg 12 (1 May 1990); doi: 1. 117/12. Read Abstract +. For repairing opaque defects on x-ray masks by focused gallium ion beams (Ga-FIB), it is important to achieve nearly vertical slopes in the remaining absorber material and to avoid the redeposition of sputtered particles. The sputter yield depends on the angle of incidence. Soft x-ray resist characterization: studies with a laser plasma x-ray source.

Douglas J. Resnick is the vice president of marketing and business development for . Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX. Resnick is the vice president of marketing and business development for Canon Nanotechnologies. Prior to this role, Doug served as the VP of mask technology and later as the VP of strategic development for molecular imprints. Outside of work, he participates on the ITRS lithography roadmap team and co-chairs the SPIE Alternative Lithography Conference. Ricardo Ruiz manages the Nanofabrication and Self Assembly Group at HGST, a Western Digital Company since 2012, where he oversees nanofabrication strategies for sub-15 nm lithography.

by SPIE-Intl Soc Optical Eng. in Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer . Development of a Nanometric E-Beam Lithography System (JBX-5DII). assel Shearer, H. Takemura, M. Isobe, N. Goto, K. Tanaka, S. Miyauchi. Published: 20 June 1985

by SPIE-Intl Soc Optical Eng. in Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies IV. Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies IV, Volume 537, pp 168-175; doi:10. The publisher has not yet granted permission to display this abstract. Published: 20 June 1985. by SPIE-Intl Soc Optical Eng.

Other books in this series. Vertical External Cavity Surface Emitting Lasers (VECSELs). Ursula . pichiger- Keller.

Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV - San Jose, CA, USA Duration: Feb . Proceedings of SPIE - The International Society for Optical Engineering.

Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV - San Jose, CA, USA Duration: Feb 28 1994 → Mar 1 1994. Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV. City. Vol. 2194 Publ by Society of Photo-Optical Instrumentation Engineers, 1994. oceedings{a5b722913a53

Publisher: SPIE, 1994.

Society for Optical Engineering). ISBN 13: 9780819414892  . Publisher: SPIE, 1994.

Cavities of microgear of 70 μm outside diameter were sputtered with submicrometer accuracy and 2–5 nm average surface roughness. The microcavities were then filled with polymer in a subsequent micromodling process. The replicated microcomponents were inspected with scanning electron microscope where faithful duplication of accuracy and surface texture of the cavity was observed.